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C10000 - SEMI C100 - Guide for Reporting Chemical Mechanical Planarization (CMP) Polishing Pads Hardness Used in Semiconductor Manufacturing Revision:SEMI C100-1120 - Current Instructor: Mark D

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Description

Instructor:  Mark D

安全監督者連絡協議会 (SSCC)

注意:「Current」のステータスを維持するための条件が現時点で満たされていないため、このスタンダードまたは安全ガイドラインは「Inactive」ステータスとなっています。「Inactive」のスタンダードまたは安全ガイドラインはSEMIから入手可能であり、引き続き有効です。

Sheet resistance is a primary quantity for characterization

C10000 - SEMI C100 - Guide for Reporting Chemical Mechanical Planarization (CMP) Polishing Pads Hardness Used in Semiconductor Manufacturing Revision:SEMI C100-1120 - Current Instructor: Mark DThis Document will provide a guide for the measurements of and reporting of more accurate parameters of hardness of chemical mechanical planarization (CMP) pads, than current industry standards. This Document will provide a guide for the measurement of and reporting of effect of the temperature on the pad hardness. Reference to this Guide can be used in the corresponding certificate of acceptance (CoA) from a CMP supplier to its customers. Reference

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